Silver-based thermal paste; Increases thermal conductivity between the CPU and heatsink and helps dissipate heat, extending the life of the CPU
Pre-loaded in a syringe for easy and precise application; Thermal conductivity: >0.965 W/M-K; Thermal impedance: < 0.255 °C-IN2/W
Specific gravity: >2.3; Evaporation: < 0.001%; Bleed: < 0.05%; Dielectric constant A: >5.1
Operating temperature: -30~180°C
Thixotropic index: 380 ±10 1/10 mm; Color: Gray
Silver-based thermal paste
Increases thermal conductivity between the CPU and heatsink
Helps dissipate heat, extending the life of the CPU
Pre-loaded in a syringe with cap for easy and precise application
