High-Performance Thermal Paste Cooler Master HTK-002 thermal conductive compounds are grease-like silicone materials, heavily filled with heat conductive metal oxides. This combination promotes high thermal conductivity, low bleed, and high-temperature stability. These compounds resist changes in consistency at temperatures up to 177°C (350°F), maintaining a positive heat sink seal to improve heat transfer from the electronic device to the heat sink or chassis, thereby increasing the overall efficiency of the device.
FEATURES:
Suitable for CPU, chipset on motherboard, VGA card, etc.
Easy to use.
Zif Socket models ensure proper application area with various CPU socket types.
